Illustrates the SIMOD process for device handling, from initial registration and testing through repair loops, retesting, packaging, and eventual scrap.
flowchart TB
subgraph FASES["FASES DEL PROCESO"]
REGISTRO["REGISTRO<br/>UReg"]
TEST["TEST_INICIAL<br/>UTI"]
RETEST["RETEST<br/>UR"]
EMPAQUE["EMPAQUE<br/>UE"]
REPARACION["REPARACION<br/>URep"]
DIAGNOSTICADO["DIAGNOSTICADO<br/>UR"]
SCRAP["SCRAP<br/>UScrap"]
end
REGISTRO --> TEST
TEST -->|PASS| RETEST
TEST -->|FAIL + CodDaño| DIAGNOSTICADO
RETEST -->|PASS| EMPAQUE
RETEST -->|FAIL + CodDaño| DIAGNOSTICADO
DIAGNOSTICADO --> REPARACION
REPARACION --> RETEST
DIAGNOSTICADO -->|3+ intentos| SCRAP
EMPAQUE -.->|Daño post-empaque| DIAGNOSTICADO
style REGISTRO fill:#3498db,color:#fff
style TEST fill:#f1c40f,color:#000
style RETEST fill:#2ecc71,color:#fff
style EMPAQUE fill:#9b59b6,color:#fff
style REPARACION fill:#e67e22,color:#fff
style DIAGNOSTICADO fill:#1abc9c,color:#fff
style SCRAP fill:#e74c3c,color:#fff
This flowchart details the SIMOD process, outlining the stages a device goes through: REGISTRO (Registration), TEST_INICIAL (Initial Test), RETEST, REPARACION (Repair), DIAGNOSTICADO (Diagnosed), EMPAQUE (Packaging), and SCRAP. It shows the flow for both successful paths (PASS to RETEST/EMPAQUE) and failure paths (FAIL to DIAGNOSTICADO, then REPARACION or SCRAP after multiple attempts). It also includes a path for post-packaging damage.
Ideal for visualizing and optimizing product repair workflows, quality control processes, and inventory management in manufacturing or service centers. Useful for training new staff or auditing existing procedures.
Customize the stages to fit specific product lifecycles or service offerings. Add more granular decision points, integrate with external systems (e.g., CRM, ERP), or modify criteria for repair attempts and scrap decisions. Adjust styling for different process owners.